Mr. Farhang Yazdani

Mr. Farhang Yazdani is the President and Chief Technical Officer of BroadPak Corporation. With over 17 years of experience in semiconductor packaging industry, he is widely regarded as an expert on 3D packaging technologies. Previously, he served in various management, technical, and advisory positions with leading semiconductor companies worldwide. He has numerous publications and US patents issued and pending in the area of Packaging and Assembly, serves on various technical committees, and is a frequent reviewer for IEEE Journal of Advanced Packaging. He has undergraduate and graduate degrees in Chemical Engineering and Mechanical Engineering from the University of Washington, Seattle. He is a member of AICHE, ASME, IEEE, IMPS, SPE and the Society of Rheology.