Lecture by Mr. Farhang Yazdani at USPTO

May, 15 2013

NIPSIA is very proud that Mr. Farhang Yazdani, the President and Chief Technical Officer of BroadPak Corporation, accepted its invitation and presented a lecture at the USPTO on "Advances in 2.5D/3D Silicon Interposer Packaging Technologies" for the USPTO patent examiners, at TC 2800 TechFair.

Abstract

As the semiconductor industry migrates toward extreme monolithic foundry level 3D heterogeneous structures for mixed-signal components and systems, 2.5D/3D silicon interposer and through silicon via (TSV) technology will play a significant role in next generation 3D packaging technologies. Ubiquitous 3D IC integration offers numerous benefits, notably, higher bandwidth, smaller footprint and lower power. 2.5D/3D approaches, such as interposers, enable heterogeneous device integration at virtually any process node. 2.5D/3D integration technologies rely on numerous leading edge technologies such as, TSV technology, wafer thinning/handling technology and micro-bump technology.

This lecture covers the fundamentals of IC packaging technologies followed by more advanced topics such as the emerging 2.5D/3D silicon interposer technologies.